The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL's LogicTouch
is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).
- Fine Pitch Capability Down to 50µm
- No Chip Design Limitations
- Single Pin Repairable
- MEMS-Style Probes
Greater Scrub Consistency
More Dimensional Control
Contact your SV TCL Representative so we can help you find the right LogicTouch product for your vertical testing needs.